Description
General part information
714-43-226-31-018000
CONN IC DIP SOCKET 26POS GOLD
Technical Specifications
Parameters and characteristics for this part
| Specification | 714-43-226-31-018000 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 30 µin |
| Contact Finish Thickness - Post | 30 µin |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass Alloy |
| Features | Closed Frame, Carrier |
| Grid Columns | 13 |
| Grid Rows | 2 |
| Housing Material | Polycyclohexylenedimethylene Terephthalate, PCT, Polyester |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 26 |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Type | 0.1" (2.54mm) Row Spacing, DIP |
Pricing
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