Specification	HPM-07-02-T-S-VS

Connector Type	Header
Contact Finish - Mating	Tin
Contact Finish - Post	Tin
Contact Material	Copper Alloy
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	0.1 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	7
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.2 in
Shrouding	Unshrouded
Style	Board
Termination	Solder
Voltage Rating (AC)	850 VAC
Voltage Rating (DC)	1200 VDC

HPM Series

Part	Fastening Type	Mounting Type	Insulation Height	Number of Rows	Contact Length - Mating	Number of Positions	Overall Contact Length	Contact Finish - Mating	Termination	Insulation Material	Insulation Color	Contact Shape	Contact Material	Operating Temperature (Min)	Operating Temperature (Max)	Contact Finish - Post	Number of Positions Loaded	Style	Contact Length - Post	Pitch - Mating	Voltage Rating (AC)	Voltage Rating (DC)	Connector Type	Material Flammability Rating	Shrouding	Contact Type	Features
Samtec Inc. HPM-08-01-T-S	Push-Pull	Through Hole	0.1 in	1	0.47 in	8	0.75 in	Tin	Solder	Polybutylene Terephthalate (PBT)	Black	Square	Copper Alloy	-55 °C	105 °C	Tin	All	Board	0.18 in	0.2 in	850 VAC	1200 VDC	Header	UL94 V-0	Unshrouded	Male Pin
Samtec Inc. HPM-20-05-T-S	Push-Pull	Through Hole	0.1 in	1	0.15 in	20	0.43 in	Tin	Solder	Polybutylene Terephthalate (PBT)	Black	Square	Copper Alloy	-55 °C	105 °C	Tin	All	Board	0.18 in	0.2 in	850 VAC	1200 VDC	Header	UL94 V-0	Unshrouded	Male Pin
Samtec Inc. HPM-18-04-T-S-RA	Push-Pull	Right Angle Through Hole	0.1 in	1		18		Tin	Solder	Polybutylene Terephthalate (PBT)	Black	Square	Copper Alloy	-55 °C	105 °C	Tin	All	Board		0.2 in	850 VAC	1200 VDC	Header	UL94 V-0	Unshrouded	Male Pin
Samtec Inc. HPM-03-01-T-S-VS-P	Push-Pull	Surface Mount	0.1 in	1		3		Tin	Solder	Liquid Crystal Polymer (LCP)	Natural	Square	Copper Alloy	-55 °C	105 °C	Tin	All	Board		0.2 in	850 VAC	1200 VDC	Header	UL94 V-0	Unshrouded	Male Pin	Pick and Place
Samtec Inc. HPM-11-02-T-S-RA	Push-Pull	Right Angle Through Hole	0.1 in	1		11		Tin	Solder	Polybutylene Terephthalate (PBT)	Black	Square	Copper Alloy	-55 °C	105 °C	Tin	All	Board		0.2 in	850 VAC	1200 VDC	Header	UL94 V-0	Unshrouded	Male Pin
Samtec Inc. HPM-19-01-T-S	Push-Pull	Through Hole	0.1 in	1	0.47 in	19	0.75 in	Tin	Solder	Polybutylene Terephthalate (PBT)	Black	Square	Copper Alloy	-55 °C	105 °C	Tin	All	Board	0.18 in	0.2 in	850 VAC	1200 VDC	Header	UL94 V-0	Unshrouded	Male Pin
Samtec Inc. HPM-10-01-T-S-VS	Push-Pull	Surface Mount	0.1 in	1		10		Tin	Solder	Liquid Crystal Polymer (LCP)	Natural	Square	Copper Alloy	-55 °C	105 °C	Tin	All	Board		0.2 in	850 VAC	1200 VDC	Header	UL94 V-0	Unshrouded	Male Pin
Samtec Inc. HPM-18-04-T-S	Push-Pull	Through Hole	0.1 in	1	0.83 in	18	1.091 in	Tin	Solder	Polybutylene Terephthalate (PBT)	Black	Square	Copper Alloy	-55 °C	105 °C	Tin	All	Board	0.161 in	0.2 in	850 VAC	1200 VDC	Header	UL94 V-0	Unshrouded	Male Pin
Samtec Inc. HPM-14-02-T-S	Push-Pull	Through Hole	0.1 in	1	0.52 in	14	0.8 in	Tin	Solder	Polybutylene Terephthalate (PBT)	Black	Square	Copper Alloy	-55 °C	105 °C	Tin	All	Board	0.18 in	0.2 in	850 VAC	1200 VDC	Header	UL94 V-0	Unshrouded	Male Pin
Samtec Inc. HPM-20-04-T-S	Push-Pull	Through Hole	0.1 in	1	0.83 in	20	1.091 in	Tin	Solder	Polybutylene Terephthalate (PBT)	Black	Square	Copper Alloy	-55 °C	105 °C	Tin	All	Board	0.161 in	0.2 in	850 VAC	1200 VDC	Header	UL94 V-0	Unshrouded	Male Pin

Pricing

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HPM-07-02-T-S-VS | Datasheet