NCSWLF.031 0.5OZ
ActiveChip Quik Inc.
LF SOLDER WIRE MINI POCKET PACK
NCSWLF.031 0.5OZ
ActiveChip Quik Inc.
LF SOLDER WIRE MINI POCKET PACK
Description
General part information
NCSWLF.031 0.5OZ
LF SOLDER WIRE MINI POCKET PACK
Technical Specifications
Parameters and characteristics for this part
| Specification | NCSWLF.031 0.5OZ |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Diameter | 0.031 in |
| Form | Tube |
| Form Weight | 0.5 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Sn Composition | 96.5 % |
| Type | Wire Solder |
| Wire Gauge | 20 AWG, 21 SWG |
Pricing
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