110-024-000

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CONN IC DIP SOCKET 24POS GOLD

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CONN IC DIP SOCKET 24POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	110-024-000

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.203 Ám
Contact Finish Thickness - Mating	8 Áin
Contact Finish Thickness - Post	Flash
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	1 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	24
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-65 ░C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.2 mm
Termination Post Length	0.126 in
Type	0.4 in
Type	10.16 mm
Type	DIP

CONN IC DIP SOCKET 24POS GOLD

Part	Features	Contact Finish - Post	Housing Material	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Contact Finish - Mating	Contact Material - Mating	Current Rating (Amps)	Operating Temperature [Max]	Operating Temperature [Min]	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post
3M 110-024-000	Open Frame	Gold	Polyphenylene Sulfide (PPS), Glass Filled	0.4 in	10.16 mm	DIP	2.54 mm	0.1 in	Brass	UL94 V-0	0.1 in	2.54 mm	3.2 mm	0.126 in	Gold	Beryllium Copper	1 A	125 °C	-65 ░C	Solder	0.203 Ám	8 Áin	Through Hole	24	Flash

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

24 (2 x 12) Pos DIP, 0.4" (10.16mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources

No documents available