ESQT-117-02-LM-D-500
ActiveSamtec Inc.
CONN SOCKET 34POS 0.079 GOLD PCB
Deep-Dive with AI
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ESQT-117-02-LM-D-500
ActiveSamtec Inc.
CONN SOCKET 34POS 0.079 GOLD PCB
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | ESQT-117-02-LM-D-500 |
|---|---|
| Connector Type | Elevated Socket |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Length - Post [x] | 8.89 mm |
| Contact Length - Post [x] | 0.35 in |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Current Rating (Amps) | 4.5 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.5 in |
| Insulation Height | 12.7 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions | 34 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating [x] | 0.079 in |
| Pitch - Mating [x] | 2 mm |
| Row Spacing - Mating | 0.079 in |
| Row Spacing - Mating | 2 mm |
| Style | Board to Board, Cable |
| Termination | Solder |
ESQT-117 Series
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| Part | Insulation Height [z] | Insulation Height [z] | Contact Finish - Mating | Contact Type | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Current Rating (Amps) | Style | Contact Length - Post | Contact Length - Post | Insulation Material | Contact Finish - Post | Fastening Type | Insulation Color | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions Loaded | Contact Material | Mounting Type | Contact Shape | Row Spacing - Mating | Row Spacing - Mating | Number of Positions | Pitch - Mating [x] | Pitch - Mating [x] | Material Flammability Rating | Connector Type | Insulation Height | Insulation Height | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Rows | Contact Length - Post [x] | Contact Length - Post [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 8.76 mm | 0.345 " | Gold | Forked | -55 °C | 125 °C | Solder | 4.5 A | Board to Board Cable | 0.113 in | 2.87 mm | Liquid Crystal Polymer (LCP) | Tin | Push-Pull | Black | 3 µin | 0.076 µm | All | Phosphor Bronze | Through Hole | Square | 0.079 in | 2 mm | 68 | 0.079 in | 2 mm | UL94 V-0 | Elevated Socket | |||||||
Samtec Inc. | Gold | Forked | -55 °C | 125 °C | Solder | 4.5 A | Board to Board Cable | 0.175 in | 4.45 mm | Liquid Crystal Polymer (LCP) | Tin | Push-Pull | Black | 10 çin | 0.25 çm | All | Phosphor Bronze | Through Hole | Square | 0.079 in | 2 mm | 68 | 0.079 in | 2 mm | UL94 V-0 | Elevated Socket | 0.675 in | 17.14 mm | |||||||
Samtec Inc. | Gold | Forked | -55 °C | 125 °C | Solder | 4.5 A | Board to Board Cable | 0.378 " | 9.6 mm | Liquid Crystal Polymer (LCP) | Gold | Push-Pull | Black | 20 µin | 0.51 µm | All | Phosphor Bronze | Through Hole | Square | 0.079 in | 2 mm | 34 | 0.079 in | 2 mm | UL94 V-0 | Elevated Socket | 0.472 in | 12 mm | 3 µin | 0.076 µm | 2 | ||||
Samtec Inc. | Gold | Forked | -55 °C | 125 °C | Solder | 4.5 A | Board to Board Cable | Liquid Crystal Polymer (LCP) | Tin | Push-Pull | Black | 10 çin | 0.25 çm | All | Phosphor Bronze | Through Hole | Square | 0.079 in | 2 mm | 34 | 0.079 in | 2 mm | UL94 V-0 | Elevated Socket | 0.5 in | 12.7 mm | 2 | 8.89 mm | 0.35 in | ||||||
Samtec Inc. | Gold | Forked | -55 °C | 125 °C | Solder | 4.5 A | Board to Board Cable | Liquid Crystal Polymer (LCP) | Gold | Push-Pull | Black | 20 µin | 0.51 µm | All | Phosphor Bronze | Through Hole | Square | 0.079 in | 2 mm | 34 | 0.079 in | 2 mm | UL94 V-0 | Elevated Socket | 0.7 in | 17.78 mm | 3 µin | 0.076 µm | 2 | 3.81 mm | 0.15 in | ||||
Samtec Inc. | Gold | Forked | -55 °C | 125 °C | Solder | 4.5 A | Board to Board Cable | 0.541 in | 13.74 mm | Liquid Crystal Polymer (LCP) | Gold | Push-Pull | Black | 20 µin | 0.51 µm | All | Phosphor Bronze | Through Hole | Square | 0.079 in | 2 mm | 34 | 0.079 in | 2 mm | UL94 V-0 | Elevated Socket | 0.309 in | 7.85 mm | 3 µin | 0.076 µm | 2 | ||||
Samtec Inc. | 13.84 mm | 0.545 in | Gold | Forked | -55 °C | 125 °C | Solder | 4.5 A | Board to Board Cable | Liquid Crystal Polymer (LCP) | Gold | Push-Pull | Black | 20 µin | 0.51 µm | All | Phosphor Bronze | Through Hole | Square | 0.079 in | 2 mm | 34 | 0.079 in | 2 mm | UL94 V-0 | Elevated Socket | 3 µin | 0.076 µm | 2 | ||||||
Samtec Inc. | Gold | Forked | -55 °C | 125 °C | Solder | 4.5 A | Board to Board Cable | 0.104 in | 2.64 mm | Liquid Crystal Polymer (LCP) | Gold | Push-Pull | Black | 20 µin | 0.51 µm | All | Phosphor Bronze | Through Hole | Square | 0.079 in | 2 mm | 34 | 0.079 in | 2 mm | UL94 V-0 | Elevated Socket | 0.354 in | 9 mm | 3 µin | 0.076 µm | 2 | ||||
Samtec Inc. | Gold | Forked | -55 °C | 125 °C | Solder | 4.5 A | Board to Board Cable | 0.128 " | 3.25 mm | Liquid Crystal Polymer (LCP) | Tin | Push-Pull | Black | 3 µin | 0.076 µm | All | Phosphor Bronze | Through Hole | Square | 0.079 in | 2 mm | 34 | 0.079 in | 2 mm | UL94 V-0 | Elevated Socket | 0.33 in | 8.38 mm | 2 | ||||||
Samtec Inc. | Gold | Forked | -55 °C | 125 °C | Solder | 4.5 A | Board to Board Cable | Liquid Crystal Polymer (LCP) | Tin | Push-Pull | Black | 20 µin | 0.51 µm | All | Phosphor Bronze | Through Hole | Square | 0.079 in | 2 mm | 34 | 0.079 in | 2 mm | UL94 V-0 | Elevated Socket | 0.73 " | 18.54 mm | 2 | 3.05 mm | 0.12 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tube | 16 | $ 9.54 | |
Description
General part information
ESQT-117 Series
34 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
Documents
Technical documentation and resources
No documents available