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403V

403V

Active
Wakefield Thermal Solutions

EXTRUDED HEAT SINK FOR POWER SEMICONDUCTORS T03, STUD MOUNT ROHS COMPLIANT: YES

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403V

403V

Active
Wakefield Thermal Solutions

EXTRUDED HEAT SINK FOR POWER SEMICONDUCTORS T03, STUD MOUNT ROHS COMPLIANT: YES

Find alt

Description

General part information

403V

EXTRUDED HEAT SINK FOR POWER SEMICONDUCTORS T03, STUD MOUNT ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

Specification403V
Attachment MethodPress Fit
Fin Height1.25 in
Length3 "
MaterialAluminum
Material FinishBlack Anodized
Package CooledTO-3
Power Dissipation30 W
ShapeFins, Rectangular
Thermal Resistance0.9 °C/W
TypeBoard Level, Extrusion
Width4.75 in

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

403V | Datasheet