Specification	MC9S08DN32MLF

A/D Channels	16 count
A/D Resolution (bits)	12 bit
Connectivity	I2C, SPI, LINbus, SCI
Core Processor	S08
Core Size (Bit Width)	8 Bit
EEPROM Size (Depth)	1 K
EEPROM Size (Width)	8 bit
Mounting Type	Surface Mount
Number of I/O	39
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	External
Package / Case	48-LQFP
Package Length	7 mm
Package Name	48-LQFP
Package Width	7 mm
Peripherals	WDT, PWM, POR, LVD
Program Memory Depth	32 K
Program Memory Size	32 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	1.5 K
RAM Size Width	8 bit
Speed	40 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	2.7 V

MC9S08 Series

...

Part	Connectivity	Package Length	Package Name	Package Width	Number of I/O	Oscillator Type	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	Speed	Operating Temperature (Max)	Operating Temperature (Min)	Mounting Type	Package / Case	Core Size (Bit Width)	RAM Size Depth	RAM Size Width	A/D Channels	A/D Resolution (bits)	Peripherals	Program Memory Type	Program Memory Size	Program Memory Width	Program Memory Depth	Core Processor	Program Memory Depth (128KB)	Program Memory Size	Program Memory Width (128KB)	EEPROM Size (Depth)	EEPROM Size (Width)
NXP USA Inc. MC9S08GT32CFD	I2C SCI SPI	7 mm	48-QFN-EP	7 mm	39	Internal	3.6 V	1.8 V	40 MHz	85 °C	-40 °C	Surface Mount	48-VFQFN Exposed Pad	8 Bit	2 K	8 bit	8 count	10 bit	LVD POR PWM WDT	FLASH	32 KB	8 bit	32 K	S08
NXP USA Inc. MC9S08QG4MDTE	I2C SCI SPI	0.173 in	16-TSSOP	4.4 mm	12	Internal	3.6 V	1.8 V	20 MHz	125 °C	-40 °C	Surface Mount		8 Bit	256	8 bit	8 count	10 bit	LVD POR PWM WDT	FLASH	4 KB	8 bit	4 K	S08
NXP USA Inc. MC9S08DV32MLH	CANbus I2C LINbus SCI SPI	10 mm	64-LQFP	10 mm	53	External	5.5 V	2.7 V	40 MHz	125 °C	-40 °C	Surface Mount	64-LQFP	8 Bit	2 K	8 bit	16 count	12 bit	LVD POR PWM WDT	FLASH	32 KB	8 bit	32 K	S08
NXP USA Inc. MC9S08AC8MFDE	I2C SCI SPI	7 mm	48-QFN-EP	7 mm	38	Internal	5.5 V	2.7 V	40 MHz	125 °C	-40 °C	Surface Mount	48-VFQFN Exposed Pad	8 Bit	768	8 bit	8 count	10 bit	LVD POR PWM WDT	FLASH	8 KB	8 bit	8 K	S08
NXP USA Inc. MC9S08QD2VSC		0.154 in	8-SOIC	3.9 mm	4	Internal	5.5 V	2.7 V	16 MHz	105 °C	-40 °C	Surface Mount		8 Bit	128	8 bit	4 count	10 bit	LVD POR PWM WDT	FLASH	2 KB	8 bit	2 K	S08
NXP USA Inc. MC9S08QE128CLH	I2C LINbus SCI SPI	10 mm	64-LQFP	10 mm	54	Internal	3.6 V	1.8 V	50 MHz	85 °C	-40 °C	Surface Mount	64-LQFP	8 Bit	8 K	8 bit	22 count	12 bit	LVD PWM WDT	FLASH				S08	128 K	128KB	8
NXP USA Inc. MC9S08JE128CMB	I2C SCI SPI USB	10 mm	81-MAPBGA	10 mm	47	Internal	3.6 V	1.8 V	48 MHz	85 °C	-40 °C	Surface Mount	81-LBGA	8 Bit	12 K	8 bit	8 count	12 bit	LVD POR PWM WDT	FLASH				S08	128 K	128KB	8
NXP USA Inc. MC9S08SH16CTJR	I2C LINbus SCI SPI	0.173 in	20-TSSOP	4.4 mm	17	Internal	5.5 V	2.7 V	40 MHz	85 °C	-40 °C	Surface Mount		8 Bit	1 K	8 bit	12 count	10 bit	LVD POR PWM WDT	FLASH	16 KB	8 bit	16 K	S08
NXP USA Inc. MC9S08DZ96MLH	CANbus I2C LINbus SCI SPI	10 mm	64-LQFP	10 mm	53	External	5.5 V	2.7 V	40 MHz	125 °C	-40 °C	Surface Mount	64-LQFP	8 Bit	6 K	8 bit	24 count	12 bit	LVD POR PWM WDT	FLASH	96 KB	8 bit	96 K	S08		96KB		2 K	8 bit
NXP USA Inc. MC9S08GT32CB	I2C SCI SPI	0.6 in	42-PDIP 42-SDIP	15.24 mm	34	Internal	3.6 V	1.8 V	40 MHz	85 °C	-40 °C	Through Hole		8 Bit	2 K	8 bit	8 count	10 bit	LVD POR PWM WDT	FLASH	32 KB	8 bit	32 K	S08

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MC9S08DN32MLF | Datasheet