JET551LT30T5
ActiveChip Quik Inc.
JET PRINTING SOLDER PASTE SN42/B
JET551LT30T5
ActiveChip Quik Inc.
JET PRINTING SOLDER PASTE SN42/B
Description
General part information
JET551LT30T5
No-Clean Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4) Syringe, 3.53 oz (100g)
Technical Specifications
Parameters and characteristics for this part
| Specification | JET551LT30T5 |
|---|---|
| Ag Composition | 0.4 % |
| Bi Composition | 57.6 % |
| Composition Elements | Sn, Bi, Ag |
| Composition Formula | Sn42Bi57.6Ag0.4 |
| Form | Syringe |
| Form Weight | 3.53 oz |
| Melting Point | 280 °F |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 42 % |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources