Specification	ESD-117-T-03

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Length - Post	0.153 in
Contact Material	Beryllium Copper
Contact Shape	Circular
Contact Type	Female Socket
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.3 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	34
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Style	Board
Termination	Solder

ESD-117 Series

Part	Contact Finish - Post	Mounting Type	Insulation Color	Number of Rows	Fastening Type	Material Flammability Rating	Operating Temperature (Max)	Operating Temperature (Min)	Insulation Height	Contact Type	Termination	Number of Positions	Contact Length - Post	Connector Type	Pitch - Mating	Row Spacing - Mating	Contact Finish - Mating	Number of Positions Loaded	Contact Finish Thickness - Mating	Style	Insulation Material	Contact Finish Thickness - Post	Contact Material	Contact Shape
Samtec Inc. ESD-118-G-06	Gold	Through Hole	Black	2	Push-Pull	UL94 V-0	125 °C	-55 °C	0.3 in	Female Socket	Solder	36	0.215 in	Elevated Socket	0.1 in	0.1 in	Gold	All	10 µin	Board
Samtec Inc. ESD-112-G-04	Gold	Through Hole	Black	2	Push-Pull	UL94 V-0	125 °C	-55 °C	0.4 in	Female Socket	Solder	24 pos	0.253 in	Elevated Socket	0.1 in	0.1 in	Gold	All	10 µin	Board	Liquid Crystal Polymer (LCP)	10 µin	Beryllium Copper	Circular
Samtec Inc. ESD-115-G-04	Gold	Through Hole	Black	2	Push-Pull	UL94 V-0	125 °C	-55 °C	0.4 in	Female Socket	Solder	30	0.253 in	Elevated Socket	0.1 in	0.1 in	Gold	All	10 µin	Board
Samtec Inc. ESD-105-T-06	Tin	Through Hole	Black	2	Push-Pull	UL94 V-0	125 °C	-55 °C	0.3 in	Female Socket	Solder	10	0.215 in	Elevated Socket	0.1 in	0.1 in	Gold	All	10 µin	Board
Samtec Inc. ESD-115-G-06	Gold	Through Hole	Black	2	Push-Pull	UL94 V-0	125 °C	-55 °C	0.3 in	Female Socket	Solder	30	0.215 in	Elevated Socket	0.1 in	0.1 in	Gold	All	10 µin	Board	Liquid Crystal Polymer (LCP)	10 µin	Beryllium Copper	Circular
Samtec Inc. ESD-113-TT-26	Tin	Through Hole	Black	2	Push-Pull	UL94 V-0	125 °C	-55 °C	0.3 in	Female Socket	Solder	26	0.215 in	Elevated Socket	0.1 in	0.1 in	Tin	All		Board	Liquid Crystal Polymer (LCP)		Beryllium Copper	Circular
Samtec Inc. ESD-115-T-26	Tin	Through Hole	Black	2	Push-Pull	UL94 V-0	125 °C	-55 °C	0.3 in	Female Socket	Solder	30	0.215 in	Elevated Socket	0.1 in	0.1 in	Gold	All	10 µin	Board	Liquid Crystal Polymer (LCP)		Beryllium Copper	Circular
Samtec Inc. ESD-102-G-05	Gold	Through Hole	Black	2	Push-Pull	UL94 V-0	125 °C	-55 °C	0.5 in	Female Socket	Solder	4	0.165 in	Elevated Socket	0.1 in	0.1 in	Gold	All	10 µin	Board	Liquid Crystal Polymer (LCP)	10 µin	Beryllium Copper	Circular
Samtec Inc. ESD-120-T-25	Tin	Through Hole	Black	2	Push-Pull	UL94 V-0	125 °C	-55 °C	0.5 in	Female Socket	Solder	40	0.165 in	Elevated Socket	0.1 in	0.1 in	Gold	All	10 µin	Board	Liquid Crystal Polymer (LCP)		Beryllium Copper	Circular
Samtec Inc. ESD-112-G-24	Gold	Through Hole	Black	2	Push-Pull	UL94 V-0	125 °C	-55 °C	0.4 in	Female Socket	Solder	24 pos	0.115 in	Elevated Socket	0.1 in	0.1 in	Gold	All	10 µin	Board

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ESD-117-T-03 | Datasheet