UPD70F3529GMA9-GBK-G

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Renesas Electronics Corporation

MCU 32-BIT V850E2/DX4-H V850E2M RISC 2048KB FLASH 3.3V/5V 176-PIN HLFQFP

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Renesas Electronics Corporation

MCU 32-BIT V850E2/DX4-H V850E2M RISC 2048KB FLASH 3.3V/5V 176-PIN HLFQFP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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General part information

The V850E2/Dx4-H is 32-bit V850E2M-H core microcontroller for high-end and high performance automotive dashboard applications.

Technical documentation and resources

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Parameters and characteristics commom to parts in this series

Specification	UPD70F3529GMA9-GBK-G	V850E2/Dx4-H Series

Connectivity	-	EBI/EMI, USB, LINbus, SPI, SCI, CANbus, SSI, Ethernet, I2C, UART/USART
Core Processor	V850E2M	V850E2M
Core Size	32-Bit Single-Core	32-Bit Single-Core, 32-Bit
Data Converters	12x10b, 12x12b	12x10b, 12x12b, 16x10b, 16x12b
Data Converters	-	10 - 12 b
Data Converters	-	32
EEPROM Size	32 K	32 K
Grade	Automotive	Automotive
Mounting Type	Surface Mount	Surface Mount
Number of I/O	127	127 - 165 I/O
Operating Temperature [Max]	105 °C	85 - 105 °C
Operating Temperature [Min]	-40 °C	-40 °C
Oscillator Type	Internal	Internal
Package / Case	176-LQFP Exposed Pad	408-BGA, 176-LQFP Exposed Pad, 352-BGA
Peripherals	DMA, WDT, POR, LVD, PWM, LCD, I2S	DMA, WDT, POR, LVD, PWM, LCD, I2S
Program Memory Size	2 GB	2 - 3 MB
Program Memory Type	FLASH	FLASH
Qualification	AEC-Q100	AEC-Q100
RAM Size	96 K	96 - 256 K
Speed	80 MHz	80 - 160 MHz
Supplier Device Package	176-HLQFP (24x24)	176-HLQFP (24x24), 352-BGA (23x23)
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	2.7 V	2.7 V

32-bit Microcontrollers

Part	Package / Case	Speed	Core Size	Core Processor	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Oscillator Type	Operating Temperature [Max]	Operating Temperature [Min]	Connectivity	Mounting Type	Data Converters [custom]	Data Converters [custom]	Program Memory Type	Number of I/O	EEPROM Size	Program Memory Size	RAM Size	Peripherals	Supplier Device Package	Data Converters	Qualification	Grade
Renesas Electronics Corporation UPD70F3537F1A9-MNM-A	408-BGA	160 MHz	32-Bit Single-Core	V850E2M	2.7 V	5.5 V	Internal	105 °C	-40 °C	CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB	Surface Mount	10 b, 12 b	32	FLASH	165 I/O	32 K	3 MB	256 K
Renesas Electronics Corporation UPD70F3529GMA-GBK-G	176-LQFP Exposed Pad	80 MHz	32-Bit	V850E2M	2.7 V	5.5 V	Internal	85 °C	-40 °C	CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB	Surface Mount			FLASH	127	32 K	2 MB	96 K	DMA, I2S, LCD, LVD, POR, PWM, WDT	176-HLQFP (24x24)	12x10b, 12x12b
Renesas Electronics Corporation UPD70F3532F1A9-KN7-A	352-BGA	160 MHz	32-Bit	V850E2M	2.7 V	5.5 V	Internal	105 °C	-40 °C	CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB	Surface Mount			FLASH	165 I/O	32 K	3 MB	256 K	DMA, I2S, LCD, LVD, POR, PWM, WDT	352-BGA (23x23)	16x10b, 16x12b
Renesas Electronics Corporation UPD70F3529GMA9-GBK-G	176-LQFP Exposed Pad	80 MHz	32-Bit Single-Core	V850E2M	2.7 V	5.5 V	Internal	105 °C	-40 °C		Surface Mount			FLASH	127	32 K	2 GB	96 K	DMA, I2S, LCD, LVD, POR, PWM, WDT	176-HLQFP (24x24)	12x10b, 12x12b	AEC-Q100	Automotive