W25N01JWSFIG TR
ActiveWinbond Electronics
IC FLASH 1GBIT SPI/QUAD 16SOIC
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W25N01JWSFIG TR
ActiveWinbond Electronics
IC FLASH 1GBIT SPI/QUAD 16SOIC
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | W25N01JWSFIG TR | W25N01 Series |
|---|---|---|
| Access Time | 6 ns | 6 - 8 ns |
| Clock Frequency | 166 MHz | 104 - 166 MHz |
| Memory Format | FLASH | FLASH |
| Memory Interface | Quad I/O, QPI, SPI, DTR | SPI - Quad I/O, DTR, Quad I/O, SPI, QPI |
| Memory Organization | 128 M | 128 M |
| Memory Size | 1 Mbit | 1 Mbit |
| Memory Type | Non-Volatile | Non-Volatile |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 85 °C | 85 °C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Package / Case | 16-SOIC | 24-TBGA, 8-WDFN Exposed Pad, 16-SOIC |
| Package / Case [x] | 0.295 in | 0.295 in |
| Package / Case [y] | 7.5 mm | 7.5 mm |
| Supplier Device Package | 16-SOIC | 24-TFBGA (8x6), 8-WSON (8x6), 16-SOIC |
| Technology | FLASH - NAND (SLC) | FLASH - NAND (SLC), FLASH - NAND |
| Voltage - Supply [Max] | 1.95 V | 1.95 - 3.6 V |
| Voltage - Supply [Min] | 1.7 V | 1.7 - 2.7 V |
| Write Cycle Time - Word, Page | 700 µs | 700 µs |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 1000 | $ 2.77 | |
W25N01 Series
IC FLASH 1GBIT SPI/QUAD 24TFBGA
| Part | Write Cycle Time - Word, Page | Package / Case | Memory Interface | Memory Organization | Technology | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Size | Supplier Device Package | Memory Type | Clock Frequency | Memory Format | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Access Time | Package / Case [x] | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25N01GWTBIG | 700 µs | 24-TBGA | SPI - Quad I/O | 128 M | FLASH - NAND (SLC) | 1.95 V | 1.7 V | 1 Mbit | 24-TFBGA (8x6) | Non-Volatile | 104 MHz | FLASH | Surface Mount | 85 °C | -40 °C | |||
Winbond Electronics W25N01GWZEIG | 700 µs | 8-WDFN Exposed Pad | SPI - Quad I/O | 128 M | FLASH - NAND (SLC) | 1.95 V | 1.7 V | 1 Mbit | 8-WSON (8x6) | Non-Volatile | 104 MHz | FLASH | Surface Mount | 85 °C | -40 °C | 8 ns | ||
Winbond Electronics W25N01GWTCIT | 700 µs | 24-TBGA | SPI - Quad I/O | 128 M | FLASH - NAND (SLC) | 1.95 V | 1.7 V | 1 Mbit | 24-TFBGA (8x6) | Non-Volatile | 104 MHz | FLASH | Surface Mount | 85 °C | -40 °C | 8 ns | ||
Winbond Electronics W25N01JWZEIG | 700 µs | 8-WDFN Exposed Pad | DTR, Quad I/O, SPI | 128 M | FLASH - NAND (SLC) | 1.95 V | 1.7 V | 1 Mbit | 8-WSON (8x6) | Non-Volatile | 166 MHz | FLASH | Surface Mount | 85 °C | -40 °C | |||
Winbond Electronics W25N01JWSFIG TR | 700 µs | 16-SOIC | DTR, QPI, Quad I/O, SPI | 128 M | FLASH - NAND (SLC) | 1.95 V | 1.7 V | 1 Mbit | 16-SOIC | Non-Volatile | 166 MHz | FLASH | Surface Mount | 85 °C | -40 °C | 6 ns | 0.295 in | 7.5 mm |
Winbond Electronics W25N01GVZEIG TR | 8-WDFN Exposed Pad | SPI | 128 M | FLASH - NAND | 3.6 V | 2.7 V | 1 Mbit | 8-WSON (8x6) | Non-Volatile | 104 MHz | FLASH | Surface Mount | 85 °C | -40 °C | ||||
Winbond Electronics W25N01GVZEIT TR | 8-WDFN Exposed Pad | SPI | 128 M | FLASH - NAND | 3.6 V | 2.7 V | 1 Mbit | 8-WSON (8x6) | Non-Volatile | 104 MHz | FLASH | Surface Mount | 85 °C | -40 °C | ||||
Winbond Electronics W25N01GVSFIT | 700 µs | 16-SOIC | SPI - Quad I/O | 128 M | FLASH - NAND (SLC) | 3.6 V | 2.7 V | 1 Mbit | 16-SOIC | Non-Volatile | 104 MHz | FLASH | Surface Mount | 85 °C | -40 °C | 0.295 in | 7.5 mm |
Description
General part information
W25N01 Series
FLASH - NAND (SLC) Memory IC 1Gbit SPI - Quad I/O, QPI, DTR 166 MHz 6 ns 16-SOIC
Documents
Technical documentation and resources