Part	Current Rating	Current Rating	Contact Finish - Mating	Contact Length - Post	Style	Pitch - Mating	Contact Length - Mating	Mounting Type	Insulation Color	Number of Positions	Number of Rows	Connector Type	Termination	Insulation Material	Contact Shape	Shrouding	Contact Finish - Post	Insulation Height	Contact Finish Thickness - Mating	Material Flammability Rating	Fastening Type	Operating Temperature (Max)	Operating Temperature (Min)	Number of Positions Loaded	Contact Material	Contact Type	Overall Contact Length	Row Spacing - Mating
Samtec Inc. HTSW-125-13-L-S	0 A	Varies by Wire Gauge	Gold	0.9 in	Board Board or Cable	0.1 in	0.23 in	Through Hole	Natural	25	1	Header	Solder	Liquid Crystal Polymer (LCP)	Square	Unshrouded	Tin	0.1 in	10 µin	UL94 V-0	Push-Pull	125 °C	-55 °C	All	Phosphor Bronze	Male Pin	1.23 in
Samtec Inc. HTSW-120-23-S-D-LL	0 A	Varies by Wire Gauge	Gold	0.115 in	Board Board or Cable	0.1 in	0.23 in	Through Hole	Natural	40	2	Header	Kinked Pin Solder	Liquid Crystal Polymer (LCP)	Square	Unshrouded	Tin	0.1 in	30 µin	UL94 V-0	Push-Pull	125 °C	-55 °C	All	Phosphor Bronze	Male Pin	0.445 in	0.1 in
Samtec Inc. HTSW-108-07-G-T	0 A	Varies by Wire Gauge	Gold	0.1 in	Board Board or Cable	0.1 in	0.23 in	Through Hole	Natural	24 pos	3	Header	Solder	Liquid Crystal Polymer (LCP)	Square	Unshrouded	Gold	0.1 in	10 µin	UL94 V-0	Push-Pull	125 °C	-55 °C	All	Phosphor Bronze	Male Pin	0.43 in	0.1 in
Samtec Inc. HTSW-116-23-S-D	0 A	Varies by Wire Gauge	Gold	0.115 in	Board Board or Cable	0.1 in	0.23 in	Through Hole	Natural	32	2	Header	Solder	Liquid Crystal Polymer (LCP)	Square	Unshrouded	Tin	0.1 in	30 µin	UL94 V-0	Push-Pull	125 °C	-55 °C	All	Phosphor Bronze	Male Pin	0.445 in	0.1 in
Samtec Inc. HTSW-120-14-T-D-LL			Tin		Board Board or Cable	0.1 in		Through Hole	Natural	40	2	Header	Solder	Liquid Crystal Polymer (LCP)	Square	Unshrouded	Tin			UL94 V-0	Push-Pull	125 °C	-55 °C		Phosphor Bronze	Male Pin
Samtec Inc. HTSW-132-20-L-D	0 A	Varies by Wire Gauge	Gold	0.11 in	Board Board or Cable	0.1 in	1.02 in	Through Hole	Natural	64	2	Header	Solder	Liquid Crystal Polymer (LCP)	Square	Unshrouded	Tin	0.1 in	10 µin	UL94 V-0	Push-Pull	125 °C	-55 °C	All	Phosphor Bronze	Male Pin	1.23 in	0.1 in
Samtec Inc. HTSW-120-30-G-S-RA	0 A	Varies by Wire Gauge	Gold	0.71 in	Board Board or Cable	0.1 in	0.32 in	Right Angle Through Hole	Natural	20	1	Header	Solder	Liquid Crystal Polymer (LCP)	Square	Unshrouded	Gold		3 µin		Push-Pull			All	Phosphor Bronze	Male Pin	1.13 in	0.1 in
Samtec Inc. HTSW-106-08-S-S-LA	0 A	Varies by Wire Gauge	Gold	0.09 in	Board Board or Cable	0.1 in	0.23 in	Right Angle Through Hole	Natural	6	1	Header	Kinked Pin Solder	Liquid Crystal Polymer (LCP)	Square	Unshrouded	Tin	0.122 in	30 µin	UL94 V-0	Push-Pull	125 °C	-55 °C	All	Phosphor Bronze	Male Pin
Samtec Inc. HTSW-112-13-F-D	0 A	Varies by Wire Gauge	Gold	0.9 in	Board Board or Cable	0.1 in	0.23 in	Through Hole	Natural	24 pos	2	Header	Solder	Liquid Crystal Polymer (LCP)	Square	Unshrouded	Tin	0.1 in	3 µin	UL94 V-0	Push-Pull	125 °C	-55 °C	All	Phosphor Bronze	Male Pin	1.23 in	0.1 in
Samtec Inc. HTSW-110-08-S-S-RA	0 A	Varies by Wire Gauge	Gold	0.09 in	Board Board or Cable	0.1 in	0.23 in	Right Angle Through Hole	Natural	10	1	Header	Solder	Liquid Crystal Polymer (LCP)	Square	Unshrouded	Tin	0.122 in	30 µin	UL94 V-0	Push-Pull	125 °C	-55 °C	All	Phosphor Bronze	Male Pin

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CAD

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Documents

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HTSW Series Other Related Documents 01

HTSW Datasheet

HTSW-120-23-G-T | Datasheet