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64-9518-11H

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Aries Electronics

CONN IC DIP SOCKET 64POS GOLD

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64-9518-11H

Active
Aries Electronics

CONN IC DIP SOCKET 64POS GOLD

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DocumentsDatasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification64-9518-11H64-9518 Series
Contact Finish - MatingGoldGold
Contact Finish - PostGoldTin, Gold
Contact Finish Thickness - Mating10 çin10 çin
Contact Finish Thickness - Mating0.25 çm0.25 çm
Contact Finish Thickness - Post10 çin10 - 200 µin
Contact Finish Thickness - Post0.25 çm0.25 - 5.08 µm
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - Post [custom]BrassBrass
Current Rating (Amps)3 A3 A
FeaturesOpen FrameOpen Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleThrough Hole
Number of Positions or Pins (Grid)6464
Pitch - Mating0.1 in0.1 in
Pitch - Mating2.54 mm2.54 mm
Pitch - Post2.54 mm2.54 mm
Pitch - Post0.1 in0.1 in
TerminationSolderSolder
Termination Post Length3.18 mm3.18 mm
Termination Post Length0.125 in0.125 in
Type22.86 mm22.86 mm
TypeDIPDIP
Type0.9 in0.9 in

64-9518 Series

CONN IC DIP SOCKET 64POS GOLD

PartContact Material - Post [custom]Pitch - MatingPitch - MatingContact Material - MatingNumber of Positions or Pins (Grid)Contact Finish - MatingMounting TypeTermination Post LengthTermination Post LengthMaterial Flammability RatingTerminationHousing MaterialContact Finish Thickness - MatingContact Finish Thickness - MatingCurrent Rating (Amps)FeaturesPitch - PostPitch - PostContact Finish - PostContact Finish Thickness - PostContact Finish Thickness - PostTypeTypeType
Aries Electronics
64-9518-10TE
Brass
0.1 in
2.54 mm
Beryllium Copper
64
Gold
Through Hole
3.18 mm
0.125 in
UL94 V-0
Solder
Glass Filled, Nylon 4/6, Polyamide (PA46)
10 çin
0.25 çm
3 A
Open Frame
2.54 mm
0.1 in
Tin
200 µin
5.08 µm
22.86 mm
DIP
0.9 in
Aries Electronics
64-9518-10T
Brass
0.1 in
2.54 mm
Beryllium Copper
64
Gold
Through Hole
3.18 mm
0.125 in
UL94 V-0
Solder
Glass Filled, Nylon 4/6, Polyamide (PA46)
10 çin
0.25 çm
3 A
Open Frame
2.54 mm
0.1 in
Tin
200 µin
5.08 µm
22.86 mm
DIP
0.9 in
Aries Electronics
64-9518-11H
Brass
0.1 in
2.54 mm
Beryllium Copper
64
Gold
Through Hole
3.18 mm
0.125 in
UL94 V-0
Solder
Glass Filled, Nylon 4/6, Polyamide (PA46)
10 çin
0.25 çm
3 A
Open Frame
2.54 mm
0.1 in
Gold
10 çin
0.25 çm
22.86 mm
DIP
0.9 in
Aries Electronics
64-9518-10E
Brass
0.1 in
2.54 mm
Beryllium Copper
64
Gold
Through Hole
3.18 mm
0.125 in
UL94 V-0
Solder
Glass Filled, Nylon 4/6, Polyamide (PA46)
10 çin
0.25 çm
3 A
Open Frame
2.54 mm
0.1 in
Tin
200 µin
5.08 µm
22.86 mm
DIP
0.9 in
Aries Electronics
64-9518-10
Brass
0.1 in
2.54 mm
Beryllium Copper
64
Gold
Through Hole
3.18 mm
0.125 in
UL94 V-0
Solder
Glass Filled, Nylon 4/6, Polyamide (PA46)
10 çin
0.25 çm
3 A
Open Frame
2.54 mm
0.1 in
Tin
200 µin
5.08 µm
22.86 mm
DIP
0.9 in
Aries Electronics
64-9518-11
Brass
0.1 in
2.54 mm
Beryllium Copper
64
Gold
Through Hole
3.18 mm
0.125 in
UL94 V-0
Solder
Glass Filled, Nylon 4/6, Polyamide (PA46)
10 çin
0.25 çm
3 A
Open Frame
2.54 mm
0.1 in
Gold
10 çin
0.25 çm
22.86 mm
DIP
0.9 in
Aries Electronics
64-9518-10H
Brass
0.1 in
2.54 mm
Beryllium Copper
64
Gold
Through Hole
3.18 mm
0.125 in
UL94 V-0
Solder
Glass Filled, Nylon 4/6, Polyamide (PA46)
10 çin
0.25 çm
3 A
Open Frame
2.54 mm
0.1 in
Tin
200 µin
5.08 µm
22.86 mm
DIP
0.9 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 23$ 16.58

Description

General part information

64-9518 Series

64 (2 x 32) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources