The VSMP series wraparound surface-mount Chip Resistor utilizes ultra high precision Bulk Metal® Z-foil. The Z-foil technology provides a significant reduction of the resistive element's sensitivity to ambient temperature variations (TCR) and to self heating when power is applied (power coefficient). Along with the inherently low PCR and TCR, Z-foil technology also provides remarkably improved load life stability, low noise and availability of tight tolerance. It has a full wraparound termination which ensures safe handling during the manufacturing process, as well as providing stability during multiple thermal cycling.