110-83-322-41-005101

Active

Preci-Dip

CONN IC DIP SOCKET 22POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

110-83-322-41-005101

Active

Preci-Dip

CONN IC DIP SOCKET 22POS GOLD

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1944	$ 1.41

Description

General part information

110-83 Series

22 (2 x 11) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	110-83-322-41-005101	110-83 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	29.5 Áin	29.5 Áin
Contact Finish Thickness - Mating	0.75 Ám	0.75 Ám
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame	Open Frame, No Center Bar
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole, Surface Mount
Number of Positions or Pins (Grid)	22	2 - 64
Number of Positions or Pins (Grid)	-	2 x 5, 2 x 16
Number of Positions or Pins (Grid)	-	10
Number of Positions or Pins (Grid)	-	3 - 20
Number of Positions or Pins (Grid)	-	2
Number of Positions or Pins (Grid)	-	32
Number of Positions or Pins (Grid)	-	6
Number of Positions or Pins (Grid)	-	4
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	-	0.118 - 0.125 in
Termination Post Length	-	3 - 3.18 mm
Type	0.3 "	0.2 - 0.9 "
Type	7.62 mm	5.08 - 22.86 mm
Type	DIP	DIP

110-83 Series

CONN IC DIP SOCKET 16POS GOLD

...

Part	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Type	Type	Type	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Contact Material - Mating	Pitch - Post	Pitch - Post	Mounting Type	Contact Material - Post [custom]	Material Flammability Rating	Contact Resistance	Features	Housing Material	Contact Finish - Post	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 110-83-316-01-931101	8, 16	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin
Preci-Dip 110-83-324-41-105161	24	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Surface Mount	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.118 in	3 mm
Preci-Dip 110-83-328-41-105161	28	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Surface Mount	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.118 in	3 mm
Preci-Dip 110-83-310-41-001101		Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.125 in	3.18 mm	2 x 5	10
Preci-Dip 110-83-210-41-005101		Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.2 in	5.08 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin			2 x 5	10
Preci-Dip 110-83-320-41-001151	20	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	UL94 V-0	10 mOhm	No Center Bar, Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.125 in	3.18 mm
Preci-Dip 110-83-640-41-005101	40	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.6 in	15.24 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Through Hole	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin					20	2
Preci-Dip 110-83-314-41-105191	14	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Surface Mount	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.118 in	3 mm
Preci-Dip 110-83-324-41-105101	24	Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Surface Mount	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.118 in	3 mm
Preci-Dip 110-83-210-41-105101		Gold	29.5 Áin	0.75 Ám	Solder	-55 °C	125 °C	0.2 in	5.08 mm	DIP	0.1 in	2.54 mm	1 A	Beryllium Copper	2.54 mm	0.1 in	Surface Mount	Brass	UL94 V-0	10 mOhm	Open Frame	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Tin	0.118 in	3 mm	2 x 5	10