26-1518-00
ActiveAries Electronics
CONN IC DIP SOCKET 26POS GOLD
26-1518-00
ActiveAries Electronics
CONN IC DIP SOCKET 26POS GOLD
Description
General part information
26-1518-00
CONN IC DIP SOCKET 26POS GOLD
Technical Specifications
Parameters and characteristics for this part
| Specification | 26-1518-00 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10 µin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Features | Open Frame |
| Grid Columns | 13 |
| Grid Rows | 2 |
| Housing Material | Nylon 4/6, Glass Filled, PA46, Polyamide |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 26 |
| Pitch - Mating | 0.1 in |
| Pitch - Post | 0.1 in |
| Row Spacing | 0.2 in |
| Termination | Solder |
| Type | 0.2" (5.08mm) Row Spacing, DIP |
Pricing
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CAD
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Documents
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