XR2A-3201-N
ActiveOmron Electronics Inc-EMC Div
CONN IC DIP SOCKET 32POS GOLD
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XR2A-3201-N
ActiveOmron Electronics Inc-EMC Div
CONN IC DIP SOCKET 32POS GOLD
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | XR2A-3201-N |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Finish Thickness - Post | 30 µin |
| Contact Finish Thickness - Post | 0.76 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Contact Resistance | 20 mOhm |
| Current Rating (Amps) | 1 A |
| Features | Open Frame |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) [custom] | 2 x 16 |
| Number of Positions or Pins (Grid) [custom] | 32 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 3.2 mm |
| Termination Post Length | 0.126 in |
| Type | DIP |
| Type | 0.6 in |
| Type | 15.24 mm |
XR2A Series
| Part | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Contact Finish - Post | Contact Material - Post | Type | Type | Type | Termination Post Length | Termination Post Length | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Current Rating (Amps) | Termination | Contact Resistance | Housing Material | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Mounting Type | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Material - Post [custom] | Termination Post Length [x] | Termination Post Length [x] | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Omron Electronics Inc-EMC Div | 2.54 mm | 0.1 in | 20 | Gold | Beryllium Copper | 0.3 " | 7.62 mm | DIP | 3.2 mm | 0.126 in | Gold | 0.1 in | 2.54 mm | UL94 V-0 | 30 Áin | 0.76 Ám | -55 °C | 125 °C | 1 A | Solder | 20 mOhm | Polybutylene Terephthalate (PBT) Glass Filled | Open Frame | 30 µin | 0.76 µm | Beryllium Copper | Through Hole | ||||||
Omron Electronics Inc-EMC Div | 2.54 mm | 0.1 in | Gold | Beryllium Copper | 0.6 in | 15.24 mm | DIP | 3.2 mm | 0.126 in | Gold | 0.1 in | 2.54 mm | UL94 V-0 | 10 çin | 0.25 çm | -55 °C | 125 °C | 1 A | Solder | 20 mOhm | Polybutylene Terephthalate (PBT) Glass Filled | Open Frame | 10 çin | 0.25 çm | Beryllium Copper | Through Hole | 2 x 16 | 32 | |||||
Omron Electronics Inc-EMC Div | 2.54 mm | 0.1 in | 8 | Gold | 0.3 " | 7.62 mm | DIP | 2.23 mm | 0.088 in | Gold | 0.1 in | 2.54 mm | UL94 V-0 | 10 çin | 0.25 çm | -55 °C | 125 °C | 1 A | Solder | 20 mOhm | Polybutylene Terephthalate (PBT) Glass Filled | Open Frame | 10 çin | 0.25 çm | Beryllium Copper | Through Hole | Brass | ||||||
Omron Electronics Inc-EMC Div | 2.54 mm | 0.1 in | 16 | Gold | Beryllium Copper | 0.3 " | 7.62 mm | DIP | 3.2 mm | 0.126 in | Gold | 0.1 in | 2.54 mm | UL94 V-0 | 10 çin | 0.25 çm | -55 °C | 125 °C | 1 A | Solder | 20 mOhm | Polybutylene Terephthalate (PBT) Glass Filled | Open Frame | 10 çin | 0.25 çm | Beryllium Copper | Through Hole | ||||||
Omron Electronics Inc-EMC Div | 2.54 mm | 0.1 in | 22 | Gold | 0.4 in | 10.16 mm | DIP | Gold | 0.1 in | 2.54 mm | UL94 V-0 | 29.5 Áin | 0.75 Ám | -55 °C | 125 °C | 1 A | Solder | 20 mOhm | Polybutylene Terephthalate (PBT) Glass Filled | Open Frame | 0.75 µm | Beryllium Copper | Through Hole | Brass | 0.138 in | 3.5 mm | 29.5 µin | ||||||
Omron Electronics Inc-EMC Div | 2.54 mm | 0.1 in | 28 | Gold | Beryllium Copper | 0.6 in | 15.24 mm | DIP | 3.2 mm | 0.126 in | Gold | 0.1 in | 2.54 mm | UL94 V-0 | 30 Áin | 0.76 Ám | -55 °C | 125 °C | 1 A | Solder | 20 mOhm | Polybutylene Terephthalate (PBT) Glass Filled | Open Frame | 30 µin | 0.76 µm | Beryllium Copper | Through Hole | ||||||
Omron Electronics Inc-EMC Div | 2.54 mm | 0.1 in | 8 | Gold | Beryllium Copper | 0.3 " | 7.62 mm | DIP | 3.2 mm | 0.126 in | Gold | 0.1 in | 2.54 mm | UL94 V-0 | 10 çin | 0.25 çm | -55 °C | 125 °C | 1 A | Solder | 20 mOhm | Polybutylene Terephthalate (PBT) Glass Filled | Open Frame | 10 çin | 0.25 çm | Beryllium Copper | Through Hole | ||||||
Omron Electronics Inc-EMC Div | 2.54 mm | 0.1 in | Gold | Beryllium Copper | 0.6 in | 15.24 mm | DIP | 3.2 mm | 0.126 in | Gold | 0.1 in | 2.54 mm | UL94 V-0 | 30 Áin | 0.76 Ám | -55 °C | 125 °C | 1 A | Solder | 20 mOhm | Polybutylene Terephthalate (PBT) Glass Filled | Open Frame | 30 µin | 0.76 µm | Beryllium Copper | Through Hole | 2 x 16 | 32 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 7.64 | |
| 15 | $ 5.59 | |||
| 30 | $ 5.18 | |||
| 60 | $ 4.80 | |||
| 105 | $ 4.52 | |||
| 255 | $ 4.12 | |||
| 510 | $ 3.85 | |||
| 1005 | $ 3.60 | |||
| 2505 | $ 3.31 | |||
Description
General part information
XR2A Series
32 (2 x 16) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources