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BALFHB-WL-01D3 - 80-WFBGA

BALFHB-WL-01D3

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STMicroelectronics

INTEGRATED FILTER MATCHED BALUN TO BGA STM32WL IN HIGH POWER MODE, 862-928 MHZ, USING 4 LAYER PCB

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BALFHB-WL-01D3 - 80-WFBGA

BALFHB-WL-01D3

Active
STMicroelectronics

INTEGRATED FILTER MATCHED BALUN TO BGA STM32WL IN HIGH POWER MODE, 862-928 MHZ, USING 4 LAYER PCB

Deep-Dive with AI

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationBALFHB-WL-01D3BALFHB-WL-01D3 Series
--
Frequency Range [Max]928 MHz928 MHz
Frequency Range [Min]862 MHz862 MHz
Insertion Loss (Max) [Max]1.6 dB1.6 dB
Mounting TypeSurface MountSurface Mount
Package / Case8-WFBGA, CSPBGA8-WFBGA, CSPBGA
Phase Difference0 °0 °
Return Loss (Min) [Min]14 dB14 dB

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 5000$ 0.22
DigikeyCut Tape (CT) 1$ 0.88
10$ 0.87
25$ 0.58
50$ 0.52
100$ 0.47
250$ 0.42
500$ 0.42
1000$ 0.30
Digi-Reel® 1$ 0.88
10$ 0.87
25$ 0.58
50$ 0.52
100$ 0.47
250$ 0.42
500$ 0.42
1000$ 0.30
Tape & Reel (TR) 5000$ 0.27
10000$ 0.26
NewarkEach (Supplied on Cut Tape) 1$ 0.60
10$ 0.56
25$ 0.55
50$ 0.54
100$ 0.52
250$ 0.51
500$ 0.49
1000$ 0.48

BALFHB-WL-01D3 Series

Integrated filter matched balun to BGA STM32WL in high power mode, 862-928 MHz, using 4 layer PCB

PartPackage / CaseMounting TypeReturn Loss (Min) [Min]Insertion Loss (Max) [Max]Frequency Range [Max]Frequency Range [Min]Phase Difference
STMicroelectronics
BALFHB-WL-01D3
STMicroelectronics
BALFHB-WL-01D3
STMicroelectronics
BALFHB-WL-01D3
8-WFBGA, CSPBGA
Surface Mount
14 dB
1.6 dB
928 MHz
862 MHz
0 °
STMicroelectronics
BALFHB-WL-01D3
STMicroelectronics
BALFHB-WL-01D3

Description

General part information

BALFHB-WL-01D3 Series

STMicroelectronics BALFHB-WL-01D3 is an ultra-miniature balun. This device integrates a matching network, balun, and harmonics filter. Matching impedance has been customized for the STM32WL sub-GHz wireless microcontrollers.

It is using STMicroelectronics IPD technology on a nonconductive glass substrate, which optimizes RF performances.