116-83-628-41-004101

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Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

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116-83-628-41-004101

Active

Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	210	$ 6.93

Description

General part information

116-83 Series

28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

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Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	116-83-628-41-004101	116-83 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	29.5 Áin	29.5 Áin
Contact Finish Thickness - Mating	0.75 Ám	0.75 Ám
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame, Elevated	Open Frame, Elevated
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	28	2 - 48
Number of Positions or Pins (Grid)	-	4
Number of Positions or Pins (Grid)	-	2 x 5, 2 x 16
Number of Positions or Pins (Grid)	-	10
Number of Positions or Pins (Grid)	-	3 - 20
Number of Positions or Pins (Grid)	-	2
Number of Positions or Pins (Grid)	-	6 - 50
Number of Positions or Pins (Grid)	-	25
Number of Positions or Pins (Grid)	-	32
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3.18 mm
Termination Post Length	0.125 in	0.125 in
Type	DIP	DIP
Type	0.6 in	0.2 - 0.6 "
Type	15.24 mm	5.08 - 15.24 mm

116-83 Series

CONN IC DIP SOCKET 4POS GOLD

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Part	Termination	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Contact Material - Mating	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Termination Post Length	Termination Post Length	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Type	Type	Type	Material Flammability Rating	Housing Material	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Mounting Type	Pitch - Mating	Pitch - Mating	Contact Resistance	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 116-83-304-41-008101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold	4	Through Hole	0.1 in	2.54 mm	10 mOhm
Preci-Dip 116-83-422-41-011101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.4 in	10.16 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	22
Preci-Dip 116-83-324-41-012101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	24
Preci-Dip 116-83-420-41-008101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.4 in	10.16 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	20
Preci-Dip 116-83-210-41-002101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.2 in	5.08 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm		2 x 5	10
Preci-Dip 116-83-316-41-012101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	16
Preci-Dip 116-83-424-41-008101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.4 in	10.16 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	24
Preci-Dip 116-83-322-41-006101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	22
Preci-Dip 116-83-328-41-007101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	28
Preci-Dip 116-83-420-41-004101	Solder	Brass	2.54 mm	0.1 in	Beryllium Copper	Elevated, Open Frame	29.5 Áin	0.75 Ám	Tin	3.18 mm	0.125 in	1 A	-55 °C	125 °C	0.4 in	10.16 mm	DIP	UL94 V-0	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Gold		Through Hole	0.1 in	2.54 mm	10 mOhm	20