XPC8240LVV200E

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NXP USA Inc.

IC MPU MPC82XX 200MHZ 352TBGA

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XPC8240LVV200E

Active

NXP USA Inc.

IC MPU MPC82XX 200MHZ 352TBGA

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DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	XPC8240LVV200E	XPC82 Series

Additional Interfaces	I²O, I2C, UART, PCI	SCC, I2C, SMC, SPI, USART, UART, I²O, PCI
Co-Processors/DSP	-	RISC CPM, Communications
Core Processor	PowerPC 603e	PowerPC G2, PowerPC 603e, PowerPC
Display & Interface Controllers	-	Video, LCD
Ethernet	-	(3)
Ethernet	-	100 Mbps
Ethernet	-	10 Mbps
Ethernet	-	10 Mbps
Graphics Acceleration	False	False
Mounting Type	Surface Mount	Surface Mount
Number of Cores/Bus Width	32 Bit, 1 Core	1 - 32 Bit
Operating Temperature [Max]	105 °C	95 - 105 °C
Operating Temperature [Min]	0 °C	-40 - 0 °C
Package / Case	352-LBGA	480-LBGA Exposed Pad, 352-LBGA, 256-BGA, 256-BBGA
RAM Controllers	SDRAM, DRAM	SDRAM, DRAM
Speed	200 MHz	66 - 250 MHz
Supplier Device Package	352-TBGA (35x35)	480-TBGA, 352-TBGA (35x35), 256-PBGA
Supplier Device Package	-	23 - 37.5
Supplier Device Package	-	23 - 37.5
USB	-	USB 1.x (1)
Voltage - I/O	3.3 V	3.3 V

XPC82 Series

IC MPU MPC82XX 200MHZ 480TBGA

Part	RAM Controllers	Number of Cores/Bus Width	Additional Interfaces	Supplier Device Package [x]	Supplier Device Package [y]	Supplier Device Package	Voltage - I/O	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Ethernet	Ethernet [Max]	Ethernet [Min]	Co-Processors/DSP	Core Processor	Speed	Package / Case	Ethernet	USB	Display & Interface Controllers
NXP USA Inc. XPC8260CVVIFBC	DRAM, SDRAM	1 Core, 32 Bit	I2C, SCC, SMC, SPI, UART, USART	37.5	37.5	480-TBGA	3.3 V	105 °C	-40 °C	Surface Mount	(3)	100 Mbps	10 Mbps	Communications, RISC CPM	PowerPC G2	200 MHz	480-LBGA Exposed Pad
NXP USA Inc. XPC8260ZUIHBC	DRAM, SDRAM	1 Core, 32 Bit	I2C, SCC, SMC, SPI, UART, USART	37.5	37.5	480-TBGA	3.3 V	105 °C	0 °C	Surface Mount	(3)	100 Mbps	10 Mbps	Communications, RISC CPM	PowerPC G2	200 MHz	480-LBGA Exposed Pad
NXP USA Inc. XPC8260VVHFBC	DRAM, SDRAM	1 Core, 32 Bit	I2C, SCC, SMC, SPI, UART, USART	37.5	37.5	480-TBGA	3.3 V	105 °C	0 °C	Surface Mount	(3)	100 Mbps	10 Mbps	Communications, RISC CPM	PowerPC G2	166 MHz	480-LBGA Exposed Pad
NXP USA Inc. XPC8240RVV250E	DRAM, SDRAM	1 Core, 32 Bit	I2C, I²O, PCI, UART			352-TBGA (35x35)	3.3 V	105 °C	0 °C	Surface Mount					PowerPC 603e	250 MHz	352-LBGA
NXP USA Inc. XPC8260ZUHFBC	DRAM, SDRAM	1 Core, 32 Bit	I2C, SCC, SMC, SPI, UART, USART	37.5	37.5	480-TBGA	3.3 V	105 °C	0 °C	Surface Mount	(3)	100 Mbps	10 Mbps	Communications, RISC CPM	PowerPC G2	166 MHz	480-LBGA Exposed Pad
NXP USA Inc. XPC823ZT66B2T	DRAM	1 Core, 32 Bit	I2C, SCC, SMC, SPI, UART	23	23	256-PBGA	3.3 V	95 °C	0 °C	Surface Mount				Communications, RISC CPM	PowerPC	66 MHz	256-BGA	10 Mbps	USB 1.x (1)	LCD, Video
NXP USA Inc. XPC823ZT75B2T	DRAM	1 Core, 32 Bit	I2C, SCC, SMC, SPI, UART	23	23	256-PBGA	3.3 V	95 °C	0 °C	Surface Mount				Communications, RISC CPM	PowerPC	75 MHz	256-BGA	10 Mbps	USB 1.x (1)	LCD, Video
NXP USA Inc. XPC8260ZUIFBC	DRAM, SDRAM	1 Core, 32 Bit	I2C, SCC, SMC, SPI, UART, USART	37.5	37.5	480-TBGA	3.3 V	105 °C	0 °C	Surface Mount	(3)	100 Mbps	10 Mbps	Communications, RISC CPM	PowerPC G2	200 MHz	480-LBGA Exposed Pad
NXP USA Inc. XPC8260CZUHFBC	DRAM, SDRAM	1 Core, 32 Bit	I2C, SCC, SMC, SPI, UART, USART	37.5	37.5	480-TBGA	3.3 V	105 °C	-40 °C	Surface Mount	(3)	100 Mbps	10 Mbps	Communications, RISC CPM	PowerPC G2	166 MHz	480-LBGA Exposed Pad
NXP USA Inc. XPC823CZT66B2T	DRAM	1 Core, 32 Bit	I2C, SCC, SMC, SPI, UART	23	23	256-PBGA	3.3 V	95 °C	-40 °C	Surface Mount				Communications, RISC CPM	PowerPC	66 MHz	256-BBGA	10 Mbps	USB 1.x (1)	LCD, Video

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

XPC82 Series

PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 352-TBGA (35x35)

Documents

Technical documentation and resources