SPHWHAHDNA27YZR3D3

Samsung Semiconductor, Inc.

LED COB D GEN3 COOL WHT SQ 5000K

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SPHWHAHDNA27YZR3D3

Samsung Semiconductor, Inc.

LED COB D GEN3 COOL WHT SQ 5000K

Deep-Dive with AI

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	1000	$ 0.67
		2000	$ 0.63
		5000	$ 0.62
		10000	$ 0.61

Description

General part information

SPHWHAHDNA27 Series

LED Lighting COBs Engines Modules Chip On Board (COB) COB D Gen3 White, Cool Square

Documents

Technical documentation and resources

No documents available

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	SPHWHAHDNA27YZR3D3	SPHWHAHDNA27 Series

CCT (K)	-	2700 - 4000 K
Color	Cool, White	Neutral, White, Warm, Cool
Configuration	Square	Square
CRI (Color Rendering Index)	90	90
Current - Max [Max]	230 mA	180 - 360 mA
Current - Test	90 mA	90 - 900 mA
Height [z]	1.5 mm	1.5 mm
Lens Type	Flat	Flat
Light Emitting Surface (LES) [diameter]	9.8 mm	9.8 mm
Lumens/Watt @ Current - Test	148 lm/W	64 - 169 lm/W
Luminous Flux @ Current/Temperature	453 lm	349 - 516 lm
Temperature - Test	85 °C	85 °C
Type	Chip On Board (COB)	Chip On Board (COB)
Viewing Angle	115 °	115 °
Voltage - Forward (Vf) (Typ)	34 V	33.7 - 34.6 V

SPHWHAHDNA27 Series

LED COB D GEN3 NEUT WHT SQ 4000K

Part	Height [z]	CRI (Color Rendering Index)	Configuration	Viewing Angle	Current - Test	Luminous Flux @ Current/Temperature	Current - Max [Max]	Lens Type	Lumens/Watt @ Current - Test	Color	Type	Temperature - Test	Light Emitting Surface (LES) [diameter]	CCT (K)	Voltage - Forward (Vf) (Typ)
Samsung Semiconductor, Inc. SPHWHAHDNA27YZT3D3	1.5 mm	90	Square	115 °	90 mA	450 lm	230 mA	Flat	147 lm/W	Neutral, White	Chip On Board (COB)	85 °C	9.8 mm	4000 K	34 V
Samsung Semiconductor, Inc. SPHWHAHDNA27YZW2A3	1.5 mm	90	Square	115 °	90 mA	349 lm	230 mA	Flat	112 lm/W	Warm, White	Chip On Board (COB)	85 °C	9.8 mm	2700 K	34.6 V
Samsung Semiconductor, Inc. SPHWHAHDNA27YZV2D2	1.5 mm	90	Square	115 °	90 mA	406 lm	230 mA	Flat	130 lm/W	Warm, White	Chip On Board (COB)	85 °C	9.8 mm	3000 K	34.6 V
Samsung Semiconductor, Inc. SPHWHAHDNA27YZU3D3	1.5 mm	90	Square	115 °	90 mA	441 lm	230 mA	Flat	144 lm/W	Warm, White	Chip On Board (COB)	85 °C	9.8 mm	3500 K	34 V
Samsung Semiconductor, Inc. SPHWHAHDNA27YZU3DB	1.5 mm	90	Square	115 °	180 mA	423 lm	360 mA	Flat	69 lm/W	Warm, White	Chip On Board (COB)	85 °C	9.8 mm	3500 K	34 V
Samsung Semiconductor, Inc. SPHWHAHDNA27WJT3DB	1.5 mm	90	Square	115 °	180 mA	510 lm	360 mA	Flat		Neutral, White	Chip On Board (COB)	85 °C	9.8 mm	4000 K
Samsung Semiconductor, Inc. SPHWHAHDNA27YZW2D3	1.5 mm	90	Square	115 °	90 mA	407 lm	230 mA	Flat	133 lm/W	Warm, White	Chip On Board (COB)	85 °C	9.8 mm	2700 K	34 V
Samsung Semiconductor, Inc. SPHWHAHDNA27YZV2DB	1.5 mm	90	Square	115 °	180 mA	423 lm	360 mA	Flat	69 lm/W	Warm, White	Chip On Board (COB)	85 °C	9.8 mm	3000 K	34 V
Samsung Semiconductor, Inc. SPHWHAHDNA27YZT3DB	1.5 mm	90	Square	115 °	180 mA	432 lm	360 mA	Flat	71 lm/W	Neutral, White	Chip On Board (COB)	85 °C	9.8 mm	4000 K	34 V
Samsung Semiconductor, Inc. SPHWHAHDNA27YZR3DC	1.5 mm	90	Square	115 °	90 mA	459 lm	180 mA	Flat	151 lm/W	Cool, White	Chip On Board (COB)	85 °C	9.8 mm		33.7 V