SMDSW.020 8OZ

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Chip Quik Inc.

SOLDER WIRE 63/37 TIN/LEAD NO-CL

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Chip Quik Inc.

SOLDER WIRE 63/37 TIN/LEAD NO-CL

Technical Specifications

Parameters and characteristics for this part

Part	Diameter [diameter]	Diameter [diameter]	Melting Point [custom]	Melting Point [custom]	Form	Form	Form	Type	Composition [custom]	Flux Type	Process	Wire Gauge
Chip Quik Inc. SMDSWLT.047 4OZ	1.19 mm	0.047 in	138 °C	280 °F	Spool	4 oz	113.4 g	Wire Solder	Bi57Sn42Ag1 (57/42/1)
Chip Quik Inc. SMDSWLT.047 2OZ	1.19 mm	0.047 in	138 °C	280 °F	Spool	2 oz	56.7 g	Wire Solder	Bi57Sn42Ag1 (57/42/1)
Chip Quik Inc. SMDSW.015 100G	0.38 mm	0.015 in	183 °C	361 °F	Spool	3.53 oz	100 g	Wire Solder		No-Clean Water Soluble	Leaded	27 AWG 28 SWG
Chip Quik Inc. SMDSWLT.047 8OZ	1.19 mm	0.047 in	138 °C	280 °F	Spool	0.5 lb 8 oz	227 g	Wire Solder	Bi57Sn42Ag1 (57/42/1)
Chip Quik Inc. SMDSW.020 8OZ	0.51 mm	0.02 in	183 °C	361 °F	Spool	0.5 lb 8 oz	227 g	Wire Solder		No-Clean Water Soluble	Leaded	24 AWG 25 mmý

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 24.91

General part information

Leaded No-Clean, Water Soluble Wire Solder Sn63Pb37 (63/37) 24 AWG, 25 SWG Spool, 8 oz (227g), 1/2 lb

Technical documentation and resources