85-PGM11007-10H

Active

Aries Electronics

CONN SOCKET PGA GOLD

Search across all available documentation for this part.

Active

Aries Electronics

CONN SOCKET PGA GOLD

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	85-PGM11007-10H	85-PGM1 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Gold, Tin
Contact Finish Thickness - Mating	10 çin	10 çin
Contact Finish Thickness - Mating	0.25 çm	0.25 çm
Contact Finish Thickness - Post	200 µin	10 - 200 çin
Contact Finish Thickness - Post	5.08 µm	0.25 - 5.08 çm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Current Rating (Amps)	3 A	3 A
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Operating Temperature [Max]	105 ░C	105 - 125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	0.165 in	0.165 in
Termination Post Length	4.19 mm	4.19 mm
Type	PGA	PGA

CONN SOCKET PGA GOLD

Part	Material Flammability Rating	Housing Material	Pitch - Post	Pitch - Post	Current Rating (Amps)	Contact Finish - Post	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Contact Finish - Mating	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Contact Material - Post [custom]	Termination
Aries Electronics 85-PGM11007-11H	UL94 V-0	Glass Filled, Nylon 4/6, Polyamide (PA46)	2.54 mm	0.1 in	3 A	Gold	Beryllium Copper	0.1 in	2.54 mm	0.165 in	4.19 mm	Gold	PGA	10 çin	0.25 çm	-55 °C	125 °C	10 çin	0.25 çm	Through Hole	Brass	Solder
Aries Electronics 85-PGM11007-10H	UL94 V-0	Glass Filled, Nylon 4/6, Polyamide (PA46)	2.54 mm	0.1 in	3 A	Tin	Beryllium Copper	0.1 in	2.54 mm	0.165 in	4.19 mm	Gold	PGA	10 çin	0.25 çm	-55 °C	105 ░C	200 µin	5.08 µm	Through Hole	Brass	Solder
Aries Electronics 85-PGM11008-11	UL94 V-0	Glass Filled, Nylon 4/6, Polyamide (PA46)	2.54 mm	0.1 in	3 A	Gold	Beryllium Copper	0.1 in	2.54 mm	0.165 in	4.19 mm	Gold	PGA	10 çin	0.25 çm	-55 °C	125 °C	10 çin	0.25 çm	Through Hole	Brass	Solder

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	14	$ 31.09

General part information

Pos PGA Socket Gold Through Hole

Technical documentation and resources