8100-410

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TWIN INDUSTRIES

BREADBOARD GENERAL PURPOSE

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TWIN INDUSTRIES

BREADBOARD GENERAL PURPOSE

Technical Specifications

Parameters and characteristics for this part

Part	Board Thickness	Board Thickness	Board Thickness	Hole Diameter [diameter]	Hole Diameter [diameter]	Circuit Pattern	Size / Dimension [x]	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [y]	Pitch [x]	Pitch [x]	Proto Board Type	Package Accepted	Size / Dimension [y]
TWIN INDUSTRIES 8100-45-LF	0.062 in	0.0625 in	1.57 mm	0.037 in	0.94 mm	Pad Per Hole (Round)	5 in	127 mm	4 "	101.6 mm	2.54 mm	0.1 in	Breadboard General Purpose
TWIN INDUSTRIES 8100-SMT10	0.062 in	0.0625 in	1.57 mm				6 in	152.4 mm	4 "		0.5 mm	0.02 in	SMD to Plated Through Hole Board	TSSOP	101.6 mm
TWIN INDUSTRIES 8100-SMT9	0.062 in	0.0625 in	1.57 mm				7.9 in	200.66 mm	3.1 in	78.74 mm			SMD to DIP	PSOP SSOP TSOP
TWIN INDUSTRIES 8100-SMT8	0.062 in	0.0625 in	1.57 mm				6 in	152.4 mm	4 "		0.5 mm	0.02 in	SMD to Plated Through Hole Board	SOIC	101.6 mm
TWIN INDUSTRIES 8100-SMT7	0.062 in	0.0625 in	1.57 mm				4.2 "	106.68 mm	4.2 "	106.68 mm			SMD to Plated Through Hole Board	SOIC
TWIN INDUSTRIES 8100-SMT11	0.062 in	0.0625 in	1.57 mm				6 in	152.4 mm	4 "				SMD to Plated Through Hole Board	QFP	101.6 mm
TWIN INDUSTRIES 8100-SMT8-LF							6 in	152.4 mm	4 "				SMD to Plated Through Hole Board	SOIC	101.6 mm
TWIN INDUSTRIES 8100-SMT10-LF							6 in	152.4 mm	4 "				SMD to Plated Through Hole Board	TSSOP	101.6 mm
TWIN INDUSTRIES 8100-4565	0.062 in	0.0625 in	1.57 mm	0.037 in	0.94 mm	Pad Per Hole (Round)	6.5 in	165.1 mm	4.5 in	114.3 mm	2.54 mm	0.1 in	Breadboard General Purpose
TWIN INDUSTRIES 8100-SMT14							6 in	152.4 mm	4 "				SMD to Plated Through Hole Board	TQFP	101.6 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Breadboard, General Purpose Pad Per Hole (Round) 0.100" (2.54mm)

Technical documentation and resources