MMBD3004SE RFG

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Taiwan Semiconductor Corporation

DIODE ARRAY GP 350V 225MA SOT23

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Taiwan Semiconductor Corporation

DIODE ARRAY GP 350V 225MA SOT23

Technical Specifications

Parameters and characteristics for this part

Specification	MMBD3004SE RFG

Current - Average Rectified (Io) (per Diode)	225 mA
Current - Reverse Leakage @ Vr	100 nA
Diode Configuration	1 Pair Series Connection
Mounting Type	Surface Mount
Operating Temperature - Junction [Max]	150 °C
Operating Temperature - Junction [Min]	-65 C
Package / Case	SOT-23-3, TO-236-3, SC-59
Reverse Recovery Time (trr)	50 ns
Speed	200 mA, 500 ns
Supplier Device Package	SOT-23
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	350 V
Voltage - Forward (Vf) (Max) @ If	1.25 V

Part	Reverse Recovery Time (trr)	Voltage - DC Reverse (Vr) (Max) [Max]	Speed	Supplier Device Package	Mounting Type	Technology	Current - Reverse Leakage @ Vr	Diode Configuration	Operating Temperature - Junction [Max]	Operating Temperature - Junction [Min]	Package / Case	Voltage - Forward (Vf) (Max) @ If	Current - Average Rectified (Io) (per Diode)
Taiwan Semiconductor Corporation MMBD3004SE RFG	50 ns	350 V	200 mA 500 ns	SOT-23	Surface Mount	Standard	100 nA	1 Pair Series Connection	150 °C	-65 C	SC-59 SOT-23-3 TO-236-3	1.25 V	225 mA

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Diode Array 1 Pair Series Connection 350 V 225mA Surface Mount TO-236-3, SC-59, SOT-23-3

Technical documentation and resources