374324B60023G
ActiveBoyd Laconia, LLC
HEAT SINK PASSIVE BGA/FPGA PIN ARRAY ADHESIVE ALUMINUM 30.6°C/W BLACK ANODIZED
374324B60023G
ActiveBoyd Laconia, LLC
HEAT SINK PASSIVE BGA/FPGA PIN ARRAY ADHESIVE ALUMINUM 30.6°C/W BLACK ANODIZED
Description
General part information
374324B60023G
HEAT SINK PASSIVE BGA/FPGA PIN ARRAY ADHESIVE ALUMINUM 30.6°C/W BLACK ANODIZED
Technical Specifications
Parameters and characteristics for this part
| Specification | 374324B60023G |
|---|---|
| Attachment Method | Solder Anchor |
| Fin Height | 0.394 in |
| Length | 1.063 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | BGA, FPGA |
| Power Dissipation | 1.5 W |
| Shape | Square, Pin Fins |
| Thermal Resistance | 30.6 °C/W, 6 °C/W |
| Type | Board Level |
| Width | 1.063 in |
Pricing
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