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TLE9461ESV33XUMA1

TLE9461ESV33XUMA1

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INFINEON

THE TLE9461ES V33 IS A MONOLITHICALLY INTEGRATED CIRCUIT IN AN EXPOSED 150 MIL POWER PACKAGE, DESIGNED FOR VARIOUS CAN AUTOMOTIVE APPLICATIONS

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TLE9461ESV33XUMA1

TLE9461ESV33XUMA1

Active
INFINEON

THE TLE9461ES V33 IS A MONOLITHICALLY INTEGRATED CIRCUIT IN AN EXPOSED 150 MIL POWER PACKAGE, DESIGNED FOR VARIOUS CAN AUTOMOTIVE APPLICATIONS

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Description

General part information

TLE9461ESV33XUMA1

The TLE9461ES V33 is a monolithically integrated circuit in an exposed pad PG-TSDSO-24-1 (150 mil) power package. The device is designed for various CAN automotive applications as main supply for the microcontroller and as interface for a CAN bus network. To support these applications, the System Basis Chip (SBC) provides the main functions, such as a 5 V lowdropout voltage regulator (LDO) for e.g. a microcontroller supply, another 5 V low-dropout voltage regulator with off-board protection for e.g. sensor supply, a HS-CAN transceiver supporting CAN FD for data transmission, a high-voltage GPIO with embedded protective functions and a 16-bit Serial Peripheral Interface (SPI) to control and monitor the device. Also implemented are a configurable timeout / window watchdog circuit with a reset feature, one Fail Output and an undervoltage reset feature. The device offers low-power modes in order to minimize current consumption on applications that are connected permanently to the battery. A wake-up from the low-power mode is possible via a message on the buses, via the bi-level sensitive monitoring/wake-up input as well as via cyclic wake.

Technical Specifications

Parameters and characteristics for this part

SpecificationTLE9461ESV33XUMA1
ApplicationsCAN
GradeAutomotive
Mounting TypeSurface Mount
Package FeaturesExposed Pad
Package Length0.154 in
Package Name24-TSSOP, PG-TSDSO-24-1
Package Width3.9 mm
QualificationAEC-Q100
TypeSystem Basis Chip (SBC)

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