NC191SNL50
ActiveChip Quik Inc.
SMOOTH FLOW LEAD-FREE SOLDER PAS
NC191SNL50
ActiveChip Quik Inc.
SMOOTH FLOW LEAD-FREE SOLDER PAS
Description
General part information
NC191SNL50
SMOOTH FLOW LEAD-FREE SOLDER PAS
Technical Specifications
Parameters and characteristics for this part
| Specification | NC191SNL50 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Form | Jar |
| Form Weight | 1.76 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 422 °F |
| Mesh Type | 4 |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Storage/Refrigeration Temperature (Maximum) | 46 °F |
| Storage/Refrigeration Temperature (Minimum) | 37 °F |
| Type | Solder Paste |
Pricing
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CAD
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Documents
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