PA0191
ActiveChip Quik Inc.
TSSOP-10-EXP-PAD TO DIP-10 SMT
PA0191
ActiveChip Quik Inc.
TSSOP-10-EXP-PAD TO DIP-10 SMT
Description
General part information
PA0191
TSSOP-10-EXP-PAD TO DIP-10 SMT
Technical Specifications
Parameters and characteristics for this part
| Specification | PA0191 |
|---|---|
| Board Thickness | 0.062 in |
| Material | FR4 Epoxy Glass |
| Number of Positions | 10 |
| Package Accepted | TSSOP |
| Pitch | 0.02 in |
| Proto Board Type | SMD, DIP |
| Size / Dimension Length | 0.7 in |
| Size / Dimension Width | 0.5 in |
Pricing
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CAD
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Documents
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