CQB-AU100-25UM
ActiveChip Quik Inc.
GOLD BONDING WIRE (AU100) GOLD 2
CQB-AU100-25UM
ActiveChip Quik Inc.
GOLD BONDING WIRE (AU100) GOLD 2
Description
General part information
CQB-AU100-25UM
GOLD BONDING WIRE (AU100) GOLD 2
Technical Specifications
Parameters and characteristics for this part
| Specification | CQB-AU100-25UM |
|---|---|
| Au Composition | 100 % |
| Composition | Au100 |
| Diameter | 0.001 in |
| Form | Spool |
| Melting Point | 1947 °F |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Type | Wire Solder |
Pricing
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CAD
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Documents
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