SMDSWLF.006 10G
ActiveChip Quik Inc.
SOLDER LF SOLDER WIRE SN96.5/AG3/CU0.5 NO-CLEAN WATER-WASHABLE .006 10G ULTRA THIN
SMDSWLF.006 10G
ActiveChip Quik Inc.
SOLDER LF SOLDER WIRE SN96.5/AG3/CU0.5 NO-CLEAN WATER-WASHABLE .006 10G ULTRA THIN
Description
General part information
SMDSWLF.006 10G
SOLDER LF SOLDER WIRE SN96.5/AG3/CU0.5 NO-CLEAN WATER-WASHABLE .006 10G ULTRA THIN
Technical Specifications
Parameters and characteristics for this part
| Specification | SMDSWLF.006 10G |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Diameter | 0.006 in |
| Flux Type | Water Soluble, No-Clean |
| Form | Spool |
| Form Weight | 0.35 oz |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Process | Lead Free |
| Sn Composition | 96.5 % |
| Type | Wire Solder |
Pricing
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