HSB07-202009
ActiveSame Sky (Formerly CUI Devices)
HEAT SINK, BGA, 20 X 20 X 9 MM
HSB07-202009
ActiveSame Sky (Formerly CUI Devices)
HEAT SINK, BGA, 20 X 20 X 9 MM
Description
General part information
HSB07-202009
Heat Sink BGA Aluminum Alloy 3.1W @ 75°C Top Mount
Technical Specifications
Parameters and characteristics for this part
| Specification | HSB07-202009 |
|---|---|
| Attachment Method | Adhesive (Not Included) |
| Fin Height | 0.354 in |
| Length | 0.787 in |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
| Package Cooled | BGA |
| Power Dissipation | 3.1 W |
| Shape | Square, Pin Fins |
| Thermal Resistance | 24.08 °C/W, 8.6 °C/W |
| Type | Top Mount |
| Width | 0.787 " |
Pricing
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CAD
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Documents
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