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40-6556-21

40-6556-21

Active
Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

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40-6556-21

40-6556-21

Active
Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

Find alt

Description

General part information

40-6556-21

CONN IC DIP SOCKET 40POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification40-6556-21
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating30 µin
Contact Finish Thickness - Post10 µin
Contact Material - MatingBeryllium Copper
Contact Material - PostBrass
FeaturesOpen Frame
Grid Columns20
Grid Rows2
Housing MaterialPPS, Glass Filled, Polyphenylene Sulfide
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)40
Pitch - Mating0.1 in
Pitch - Post0.1 in
Row Spacing0.6 in
TerminationWire Wrap
TypeDIP, 0.6" (15.24mm) Row Spacing

Pricing

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CAD

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Documents

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