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wafer level chip-scale package; 8 solder bars; body: 3.5 x 2.13 x 0.429 mm
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    wafer level chip-scale package; 8 solder bars; body: 3.5 x 2.13 x 0.429 mm | Nexperia USA Inc. GAN3R2-100CBEAZ | Zenode.ai