wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Nexperia USA Inc. PCMF1USB3BA/CZ

wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body

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